Logic boards are crucial for electronic devices, but directly applying insulating glue on them has multiple drawbacks. Glue can interfere with electrical performance by increasing parasitic capacitance or causing electrochemical migration. It also leads to thermal expansion stress damage, deteriorates heat dissipation, reduces maintainability, and causes material compatibility issues. Instead, professional alternatives like conformal coatings such as Parylene C, which meet IPC - CC - 830B standard, are recommended. In special cases, nanocoating technologies can be considered.